MEECC Main Session

Monday, May 16, 2005

0700 0800 BREAKFAST

0800 0820 Opening of MEECC – Introductions

0820 0915 Keynote Speaker – Brigadier General Ted F. Bowlds, Deputy for Acquisition, Aeronautical Systems Center (ASC), Air Force Material Command (AFMC)

0915 1010 Principal Speaker – Ted J. Glum, Director of the Defense Microelectronics Activity (DMEA). Reporting directly to the Deputy Under Secretary of Defense for Logistics and Material Readiness.

1010 1030 Break

1030 1200 User Panel – Embedded Electronics in the Military: today's challenges and tomorrow's opportunities. Jim Robles, Sr. Technical Fellow, Boeing, Stephen Cecil, Sr. Electronics Engineer, NSWC Crane, Dr. C. Douglass Locke, President, Locke Consulting LLC. Ray Gorka, Sr. Systems Engineer, Lockheed Martin - Maritime Systems and Sensors Div.

1200 1330 Meet the Sponsors/Lunch

1330 1500 Industry Advocates Panel - Embedded Electronics in the Military: today's challenges and tomorrow's opportunities. Dr. John Zolper, Dir. Microsystems Technology Office - DARPA, Brad Curran, Analyst Frost & Sullivan, Glen Logan, Lt Col.Ret., Senior Systems Engineer, American Systems Corp., DoD Open Systems Joint Task Force

1500 1520 Break

1520 1650 Supplier Panel - Embedded Electronics in the Military: today's challenges and tomorrow's opportunities. Andrew P. Leuthe, Director Product Marketing, Titan Advanced Products & Design, Peter Robinson, Mgr. Business Development, AMD, Rich Jaenicke. Mercury Computer, Director Product Marketing.

1650 1700 Notices and important Information

1730 1830 Meet the Sponsors – Refreshments

1830 2000 Ask the Panelists – Buffet. An opportunity for the panelists and our attendees to exchange information.

Tuesday, May 17, 2005

Track 1 – CoolCon™ (morning and afternoon)

		Organization	Speaker	Title
0830	0840	MEECC		Welcome to CoolCon
0840	0950	Cray Inc.	Greg Pautsch	Worst-case Cooling in High-end Computing
0950	1030	Lytron	Kathryn Whitenack	The INEMI Thermal Roadmap
1030	1050	Break
1050	1120	Lytron	Kathryn Whitenack	Thermal Analysis
1120	1135	Parker Hannifin	Rex Harvey	VITA-50 Cooling Spec update
1135	1200	Mercury Computer	Randy Banton	Cooling methods for V-48 update
1330	Meet the Sponsors/Lunch
1330	1405	ISR	Dave Tilton	Spray Cooling Update
1405	1440	Innovative Research	Kanchan Kelkar	Thermal Analysis Modeling
1440	1500	Break
1500	1530	nanoCoolers	Mick Wilcox	Liquid Metal Cooling
1530	1600	AMD	Chris Parr	New Ideas for System Management Techniques
1600		Close of CoolCon

Track 2 – DMEA (morning), Conferences & Associations (afternoon)

		Organization	Speaker	Title
0800	0810	DMEA	Doug Casanova	Introduction
0810	0840	DMEA	Keith Bergevin	Effective Method to Replace an Aging Microprocessors – Based Subsystems with no Impact to Mission Software.
0840	0910	Northrop Grumman	Steve Buss	Parts Obsolescence Stimulates Technology Refresh
0910	0940	Honeywell Inter.	Michael Pyne	Reducing Weapons System Procurements Costs Through Open Systems Architectures
0940	1010	DMEA	Vance Anderson	Will technology bite back?  Looking at new impacts on DoD microelectronics
1010	1030	Break
1030	1100	Raytheon	George Lawton	AN/GPN-22 Precision Approach Radar Transmitter Upgrade
1100	1200	Panel Session	All Speakers	Transformational Opportunities in Military Electronics
1200	1330	Meet the Sponsors/Lunch
1330	1350	CMSE	Leon Hamiter	Executive overview and conference update
1350	1430	SISO,NMASTC&DCVC	Warren Katz	Executive overviews and update on organizations activities – SISO DCVC
1430	1500	VSO	John Rynearson	Update on activities affecting the military market.
1500		Close of Track 2
1500	1700			Editorial meetings between the sponsors and industry editors.

Track 3 – New Embedded Products (morning), Mil Program Update (afternoon)

		Organization	Speaker	New Product Announcement
0800		Pentek		Announces Blazingly Fast Data-Capture and Processing Board with 2 GHz Sampling Rate
		Radstone		Announces AXIS Advanced Multi-Processing Integrated Software
		Aitech		New radiation-tolerant, space-qualified 3U CompactPCI SBC provides performance increase of up to 5x at significantly reduced cost
		Elma		Announces new conduction cooled ATR enclosures
		TEK Microsystems, Inc. and QinetiQ		Announcing Quixilica Callisto VXS-1 the only VXS-based processing platform to provide FPGA processing at the core of the system
1000		SBS Technologies		Announces New Conduction-cooled PCI Mezzanine Card with FPGA Configurable Multiple I/O Functions
		Mercury Computer Systems		Introduces the RACE++ Series MYRIAD -4130 Conduction-Cooled Carrier Board
		SKY Computers		Announces Plans for Family of VXS Systems
		Thales		Adds Powerful Storage Feature to PowerNode3 Compute Node Single-Board Solution
		Curtiss-Wright		Introduces Rugged, Compact 20-Port Gigabit Ethernet Switch System
		ACT/technico		Announces and Demonstrates 2eSST System Platform
1200	1330	Meet the Sponsors/Lunch
1330	1400	COTS Journal	Warren Andrews	DoD Budget, changes and affects on the Embedded Market.
1400	1430	Military Embedded Sys.	Chris Ciufo	Update and industry impact of two major Mil Programs
1430	1500	Military & Aero. Elect.	John Keller	Update and industry impact of two major Mil Programs
1500		Close of Track 3
1500	1700			Editorial meetings between the sponsors and industry editors

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