MEECC 2006 Presentations: May 16-17, 2006

Main Session

Keynote

Dr. Robert F. Leheny, Deputy Director, Defense Advanced Research Projects Agency

Principal

Dennis Carlson, President, Carlson Technologies, Inc. “Line Replaceable Units/Modules in Military and Avionics Programs” (no slides)

Embedded Electronics in the Military: Today’s Challenges / Tomorrow’s Opportunities

User Panel

Stephen Cecil, Sr. Electronics Eng., NSWC Crane
Larry Jenkins, Technical Expert, USAF Aero. Sys. Center (no slides)

Industry Advocates Panel

Robert McKee, PM, Platforms and Operational Units, MITRE Corporation
Glen Logan, Sr., Systems Engineer, Open Systems Joint Task Force
Keith W. Jones, Capabilities Engineer and Scientist, ASC/XRS

Supplier Panel

Joe Baddeley, VP Product Development, ISR Inc.
Doug Patterson, VP WW Sales & Marketing, Aitech Defense Systems, Inc.
John Wemekamp, CTO, Curtiss-Wright Controls Embedded Systems

CoolCON

Large Cooling Applications in Particle Physics”, Bob Downing, Consultant to SLAC
Composite Materials in Cooling”, Kris Vasoya & Carol Burch, Thermalworks
New Developments in Cooling”, Ivan Straznicky, Sr. Staff Mechanical Engineer, Curtiss-Wright Controls and Embedded Computing
ASHRAE Update”, Kathryn Whitenack, Director of Marketing, Lytron
Forced-Air 'Plenum' Cooling . . .Two Years Later”, Randy Banton, VP Engineering, Mercury Computer Systems

Mil & Avionic Programs Update

Future Combat Systems”, Jeff Child, Group Editorial Director, COTS Journal, RTC Group
“Joint STARS”, John Carr, Engineering Manager, Joint STARS Development Programs, Northrup Grumman (no slides)
“C-17”, Stephen Trimble, Bureau Chief, Jane’s Defence Weekly (no slides)
“WIN-T”, Henry Kenyon, Editor, SIGNAL (no slides)

RoHS – How To . . .

“DoD Efforts to Address Lead-Free Impacts”, Kevin Rankin, Chief, Microelectronics Systems, DMEA
Mixed Alloys (When Lead Meets Lead Free)”, Neil Poole, Sr. Applications Chemist, Henkel Corporation

New products introduced at MEECC 2006

North Atlantic Industries, Inc. — Gigabit Ethernet-capable, Single-Slot, Multi-Function, VME Card Now Available
DRS Technologies, Inc. — Most Advanced High-performance Embedded Computer Available In Defense Market Today
General Micro Systems — Full Featured, High-Performance PC for Military Manpack Applications
Parker Hannifin Corp. — New Liquid Flow-through (Lft) Electronics Chassis LFT Chassis Supports VPX REDI VITA 48 Implementations
Aitech Defense Systems — SBC Maximizes Functionality And Power With Independent Dual Processors, Distributed Architecture
Mercury Computer Systems — RapidIO-Based VXS Starter Kit; First in COTS Starter Kit Series
Pentek — Real-Time Multiband Recording and Playback Transceiver Development Platform Boasts Improved Performance and System Density
Cornet Technology, Inc. — Celero Multi-processor VME Board
Curtiss-Wright Controls Embedded Computing — 64 GB XMC/PMC Solid State Flash Disk Card
GE Fanuc Embedded Systems — New NEXUS™ Quattro VME Multiprocessor Board Designed to Meet Embedded Advanced Signal and Image Processing Applications
Nallatech — New V-4 Offerings Reinforce FPGA Leadership